Scalable board architecture design & mechanical adaptations for infrared scene projector systems

Abstract

Infrared scene projectors (IRSPs) are critical laboratory tools for setup, calibration, and testing of infrared imaging systems. Projectors are progressing to handle higher resolution, faster frame rates, and improvement in thermal performance. In recent years, the progress for the development of IRSP systems has reached a point to be able to accommodate larger hybrids. By adding more Infrared Light Emitting Diodes (IRLEDs) to the hybrid array, this created the beginning of implementing the next stage in improving the hardware architecture in the rest of the IRSP system, creating the necessity to increase the amount of signal channels that are routed to the cryogenic packaging from the Close Support Electronics(CSE). The current cryogenic package being used is a pour-filled Dewar that currently houses the IRLED array and the flip-chip bonded Complimentary-Metal-Oxide-Semiconductor (CMOS) Read-In-Integrated-Circuit (RIIC). This thesis will describe a modular hardware architecture design that will let the hardware develop with the firmware and explain mechanical adaptations to allow the continued use of the current pour-filled Dewar. While also describing the current High-Definition Light Emitting Diode (HDILED) IRSP System and its components.