Hybrid laser integration for silicon photonics platform
| Author(s) | Yang, Shuyu | |
| Date Accessioned | 2015-10-26T14:16:39Z | |
| Date Available | 2015-10-26T14:16:39Z | |
| Publication Date | 2015 | |
| Abstract | Silicon photonics has attracted extensive attention in both academia and industry in recent years, as an enabling technology to address the exponentially increasing demands for communication bandwidth. It brings state-of-the-art complementary metal-oxide-semiconductor (CMOS) processing technology to the field of photonic integration. The high yield and uniformity of silicon devices make it possible to build complex photonic systems-on-chip in large production volumes. Cutting-edge device performance has been demonstrated on this platform, including high-speed modulators, photodetectors, and passive devices such as the Y-junction, waveguide crossing, and arrayed waveguide gratings. As the device library quickly matures, an integrated laser source for a transmitter remains missing from the design kit. I demonstrated hybrid external cavity lasers by integrating reflective optical semiconductor amplifiers and silicon photonics chips. The gain chip and silicon chip can be designed and optimized independently, which is a significant advantage compared to bonding an III-V film on top of the silicon chip. Advanced optoelectronics packaging processes can be leveraged for chip alignment. Tunable C-Band (near 1550 nm) lasers with 10 mW on-chip power and less than 220 kHz bandwidth are demonstrated. O-Band lasers (operating near 1310 nm) as well as successful data transmission at 10 Gb/s and 40 Gb/s using the hybrid laser as the light source are also demonstrated. I designed a single cavity, multi wavelength laser by utilizing a quantum dot SOA, Sagnac loop and micro-ring based silicon photonics half cavity. Four lasing peaks with less than 3 dB power non-uniformity were measured, as well as 4 × 10 Gb/s error free data transmission. In addition to my main focus on RSOA/Silicon external cavity lasers, I propose and demonstrate a novel germanium-assisted grating coupler with low loss on-and-off chip fiber coupling. A coupling efficiency of 76% at 1.55 μm and 40 nm 1 dB optical bandwidth is achieved using FDTD simulation. | en_US |
| Advisor | Mirotznik, Mark S. | |
| Degree | Ph.D. | |
| Department | University of Delaware, Department of Electrical and Computer Engineering | |
| DOI | https://doi.org/10.58088/46ey-5571 | |
| Unique Identifier | 926718298 | |
| URL | http://udspace.udel.edu/handle/19716/17201 | |
| Publisher | University of Delaware | en_US |
| URI | http://search.proquest.com/docview/1708646832?accountid=10457 | |
| dc.subject.lcsh | Photonics. | |
| dc.subject.lcsh | Silicon. | |
| dc.subject.lcsh | Lasers. | |
| dc.subject.lcsh | Germanium. | |
| Title | Hybrid laser integration for silicon photonics platform | en_US |
| Type | Thesis | en_US |