Improvements and innovations on testing procedure for read-in integrated silicon chips to be used in infrared scene projectors
Date
2022
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Publisher
University of Delaware
Abstract
Infrared technology is a field with a number of different applications, from military use to academic research. In order for this technology to be properly tested, devices and procedures must exist that allow for the creation of a controllable IR testing environment. Chip Design Systems has designed and manufactured a device called the Infrared Scene Projector that allows for a programmable and dynamic testing environment via high resolution infrared scenes. ☐ In order to manufacture the Infrared Scene Projector (IRSP), a silicon chip called a Read In Integrated Circuit (RIIC) is required to drive the LED array that produces the infrared scene image. Creating these silicon chips is a highly volatile and complex process, and it is highly common that most chips do not perform exactly as designed, with different tolerances of error determining which chips are accepted for use and which are not. In order to evaluate the performance of these RIICs, Chip Design Systems developed a novel testing procedure in order to determine which RIICs are appropriate for use in the manufacturing of IRSPs. ☐ This testing procedure, as a result of its niche use case, benefits greatly from innovation and improvement in order to sustain itself for future chip designs. Tests are able to be completed more efficiently and with greater ease of use allow for a major bottleneck in the IRSP manufacturing process to be amended.