Fabrication and testing procedures for infrared scene projector closed support electronics and wafer application
Date
2020
Authors
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Publisher
University of Delaware
Abstract
Infrared scene projection has become an important laboratory tool for many
researchers as it can detect information that cannot be perceived by the human eye,
and therefore has numerous applications across multiple fields. In 2014, our group
developed the first infrared LED scene projector, which can produce high resolution
IR scenes. Due to the importance of the infrared detectors in today’s world, it is
necessary to accurately test and characterize these detectors. More specifically, it is
essential that the system components fabricated by our group are thoroughly tested
and quality controlled to ensure they will operate properly when integrated into the
projector system. ☐ Developing Infrared Scene Projectors (IRSPs) requires consistent performance
from the Close Support Electronics (CSE) used to drive the IRSP systems as well as
the wafer, which includes an attached Read-In Integrated Circuit (RIIC) and LED
array, that is used to display the images drawn to the array. This paper describes a
procedure for fabricating and testing multiple CSE units in addition to the creation of
a new modular test for analyzing the operation of a wafer. The testing approach for
the CSE units requires both a diagnostic electrical test as well as a rotational test that
is used to measure the success of the system. Additionally, the newly developed test
for the wafer is designed to ensure the RIIC is functioning properly and can drive each
LED on the array with a controllable current signal.
Description
Keywords
Close support electronics, Infrared scene projectors, Light emitting diode array, Read-in integrated circuit, Wafer